ELECTRONICS WEEKLY - Aug 28 - Intel has unveiled its new 10x30mm XMM 6255 multi-chip module, capable of dual band 3G/2G connectivity. The chip is a 65nm design and integrates 3G HSPA, power amplifiers, and power management. The chip will also work with small volume antennas. It is available in the u-blox SARA-U2 module.
by Richard Wilson
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